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Project Descriptions
Spring 2026

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Showing 3 projects out of 3 found. On page 1 out of 1.
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Topological Quantum Materials for Low-Resistance Electronics

Asir Intisar Khan - Professor, Electrical Engineering and Computer Science

Status: Current Term Now Closed     Weekly Hours: to be negotiated     Location: On Campus

Modern AI and data-intensive technologies demand faster, smaller, and far more energy-efficient electronic devices. However, as today’s electronics continue to shrink, traditional materials, such as metals, are approaching fundamental limits. When metals become thin, their electrical resistivity increases sharply due to electron scattering at their surfaces. This leads...

 Mathematical and Physical Sciences   Engineering, Design & Technologies

Energy-efficient and High-Density Memory Technologies for AI-Hardware

Asir Intisar Khan - Professor, Electrical Engineering and Computer Science

Status: Current Term Now Closed     Weekly Hours: to be negotiated     Location: On Campus

Data-centric applications face growing latency and energy challenges due to the separation of logic and memory components in traditional computing architecture. Neuro-inspired computing, modeled on the brain’s energy-efficient neural networks, offers a promising solution by reducing off-chip memory access. However, existing memory technologies struggle to achieve...

 Mathematical and Physical Sciences   Engineering, Design & Technologies

Nanoscale Thermal Management for Electronic Devices

Asir Intisar Khan - Professor, Electrical Engineering and Computer Science

Status: Current Term Now Closed     Weekly Hours: to be negotiated     Location: On Campus

As nanoelectronics evolves, managing heat becomes critical, particularly in high-density 3D chips for AI workloads. Uneven power dissipation leads to localized ‘hot spots’ that compromise device reliability and safety. Current thermal management approaches, such as using high thermal conductivity materials, optimizing through-silicon vias, and passive cooling, often overlook...

 Mathematical and Physical Sciences   Engineering, Design & Technologies

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